The OECD.AI Policy Navigator

Our policy navigator is a living repository from more than 80 jurisdictions and organisations. Use the filters to browse initiatives and find what you are looking for.

Joining Chips Joint Undertaking (JU)

Latvia plans to join the Chips JU and establish a national semiconductor competence centre. The initiative aims to strengthen the national semiconductor ecosystem and is supported by multi-year co-funding.

Name in original language

-

Initiative overview

In October 2024, Latvia amended its regulations to enable full participation in the EU Chips Joint Undertaking (Chips JU), allowing national research institutions and companies to access Horizon Europe co-financing. The initiative is framed as part of a tripartite European partnership on advanced nanoelectronics and microchips, aimed at strengthening Latvia’s semiconductor competence. Implementation will be coordinated by the Ministry of Education and Science together with line ministries and national research bodies. 

 

Name of responsible organisation (in English)

Latvian Ministry of Education and Science Republic of Latvia

About the policy initiative


Organisation:

  • Latvian Ministry of Education and Science Republic of Latvia

Category:

  • AI policy initiatives, programmes and projects

Initiative type:

  • Networks, communities of practice, ecosystem-building efforts and collaborative platforms

Status:

  • Proposed or under development

Start Year:

  • 2025

Binding:

  • Non-binding